AR03BPC3Y2002
vs
P0603E2002BN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
TOKEN ELECTRONICS INDUSTRY CO LTD
VISHAY INTERTECHNOLOGY INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
Construction
Chip
Chip
JESD-609 Code
e3
e2
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.5 mm
Package Length
1.55 mm
1.52 mm
Package Style
SMT
SMT
Package Width
0.8 mm
0.85 mm
Packing Method
Bulk
TR; TUBE; WAFFLE PACK
Rated Power Dissipation (P)
0.0625 W
0.125 W
Resistance
20000 Ω
20000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
TIN SILVER OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
50 V
50 V
Base Number Matches
1
2
Package Description
CHIP
Factory Lead Time
19 Weeks
Additional Feature
PRECISION, LASER TRIMMABLE
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Reference Standard
MIL-PRF-55342G
Compare AR03BPC3Y2002 with alternatives
Compare P0603E2002BN with alternatives