AR1020-I/SO
vs
AR1020-I/ML
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
QFN
|
Package Description |
7.50 MM, ROHS COMPLIANT, PLASTIC, SOIC-20
|
4 X 4 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
6 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PDSO-G20
|
S-PQCC-N20
|
JESD-609 Code |
e3
|
e3
|
Length |
12.8 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVQCCN
|
Package Equivalence Code |
SOP20,.4
|
LCC20,.16SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
2.65 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare AR1020-I/SO with alternatives
Compare AR1020-I/ML with alternatives