AR8033-AL1A
vs
S2009TB
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
QUALCOMM INC
|
APPLIED MICRO CIRCUITS CORP
|
| Package Description |
QFN-48
|
LBGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| Samacsys Manufacturer |
Qualcomm
|
|
| Data Rate |
1000000 Mbps
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-PBGA-B208
|
| Length |
6 mm
|
23 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
208
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LBGA
|
| Package Equivalence Code |
LCC48,.24SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Seated Height-Max |
0.8 mm
|
1.65 mm
|
| Supply Current-Max |
113.7 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
6 mm
|
23 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
208
|
| HTS Code |
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AR8033-AL1A with alternatives
Compare S2009TB with alternatives