ASM3I2669AF-06OR
vs
ASM3P2669AG-06OR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
ALLIANCE SEMICONDUCTOR CORP
|
Part Package Code |
SOT-23
|
SOT
|
Package Description |
LEAD FREE, TSOT-23, 6 PIN
|
VSSOP,
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
318G-02
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
ALSO OPERATES WITH 2.5V SUPPLY
|
ALSO OPERATES AT 3.3 V SUPPLY
|
Family |
3I
|
2669
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
|
Length |
2.9 mm
|
2.9 mm
|
Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
6
|
8
|
Number of True Outputs |
1
|
1
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VSSOP
|
Package Equivalence Code |
TSOP6,.11,37
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.6 mm
|
1.6 mm
|
fmax-Min |
13 MHz
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ASM3I2669AF-06OR with alternatives
Compare ASM3P2669AG-06OR with alternatives