AT24C02C-W-11M
vs
GT24C02-3GLA1-TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
GIANTEC SEMICONDUCTOR INC
Package Description
DIE
SOP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
100 YEAR DATA RETENTION
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
Data Retention Time-Min
100
Endurance
1000000 Write/Erase Cycles
I2C Control Byte
1010DDDR
JESD-30 Code
R-XUUC-N
R-PDSO-G8
Memory Density
2048 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X8
256X8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
2
1
Length
4.9 mm
Number of Terminals
8
Seated Height-Max
1.75 mm
Terminal Pitch
1.27 mm
Width
3.9 mm