AT24C02C-WWU11M vs BR24G02FVT-3AGTE2 feature comparison

AT24C02C-WWU11M Microchip Technology Inc

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BR24G02FVT-3AGTE2 ROHM Semiconductor

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ROHM CO LTD
Package Description WAFER TSSOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2016-12-07
Additional Feature ALSO OPERATES 1.7V AT 400 KHZ
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR
JESD-30 Code X-XUUC-N R-PDSO-G8
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256X8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Length 4.4 mm
Moisture Sensitivity Level 1
Number of Terminals 8
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Terminal Finish PURE TIN
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 10
Width 3 mm

Compare AT24C02C-WWU11M with alternatives

Compare BR24G02FVT-3AGTE2 with alternatives