AT24C02C-X9M-T vs BR24G02FVT-3AGE2 feature comparison

AT24C02C-X9M-T Atmel Corporation

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BR24G02FVT-3AGE2 ROHM Semiconductor

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Part Life Cycle Code Transferred Active
Ihs Manufacturer ATMEL CORP ROHM CO LTD
Package Description TSSOP, TSSOP,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Date Of Intro 2016-10-04
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.4 mm 4.4 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 1.2 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 1.6 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3 mm 3 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 11 Weeks
Additional Feature 1.7V AT 1MHZ
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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