AT24C02CU3-CUM-T
vs
AT24C02C-XHM-T-537
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ATMEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
Package Description
VFBGA,
TSSOP-8
Pin Count
8
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.1.B.1
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
100 YEAR DATA RETENTION
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
Data Retention Time-Min
100
100
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010DDDR
1010DDDR
JESD-30 Code
R-PBGA-B8
R-PDSO-G8
JESD-609 Code
e3
Length
2 mm
4.4 mm
Memory Density
2097152 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
262144 words
256 words
Number of Words Code
256000
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Seated Height-Max
0.85 mm
1.2 mm
Serial Bus Type
I2C
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Width
1.5 mm
3 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
2
1
Factory Lead Time
8 Weeks
Number of Ports
1
Output Characteristics
OPEN-DRAIN
Package Equivalence Code
TSSOP8,.25
Programming Voltage
5 V
Standby Current-Max
0.000006 A
Supply Current-Max
0.003 mA
Supply Voltage-Nom (Vsup)
5 V
Write Protection
HARDWARE
Compare AT24C02CU3-CUM-T with alternatives
Compare AT24C02C-XHM-T-537 with alternatives