AT45DB081D-SSU-SL955
vs
XC17512LPD8C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ATMEL CORP
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8
|
DIP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Additional Feature |
ORGANIZED AS 4096 PAGES OF 256 BYTES EACH
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
Clock Frequency-Max (fCLK) |
66 MHz
|
|
Data Retention Time-Min |
20
|
|
Endurance |
100000 Write/Erase Cycles
|
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.925 mm
|
9.3599 mm
|
Memory Density |
8388608 bit
|
524288 bit
|
Memory IC Type |
FLASH
|
CONFIGURATION MEMORY
|
Memory Width |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
8388608 words
|
524288 words
|
Number of Words Code |
8000000
|
512000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8MX1
|
512KX1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Programming Voltage |
2.7 V
|
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.75 mm
|
4.5974 mm
|
Serial Bus Type |
SPI
|
|
Standby Current-Max |
0.00001 A
|
|
Supply Current-Max |
0.017 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Type |
NOR TYPE
|
|
Width |
3.9 mm
|
7.62 mm
|
Write Protection |
HARDWARE/SOFTWARE
|
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
225
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AT45DB081D-SSU-SL955 with alternatives