AT93C66-10PI-2.7
vs
93AA66C-E/P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Base Number Matches |
1
|
1
|
| Source Content uid |
|
93AA66C-E/P
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Package Description |
|
0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Alternate Memory Width |
|
8
|
| Clock Frequency-Max (fCLK) |
|
2 MHz
|
| JESD-30 Code |
|
R-PDIP-T8
|
| JESD-609 Code |
|
e3
|
| Length |
|
9.46 mm
|
| Memory Density |
|
1024 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Number of Words |
|
128 words
|
| Number of Words Code |
|
128
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
128X8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Parallel/Serial |
|
SERIAL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.32 mm
|
| Serial Bus Type |
|
MICROWIRE
|
| Supply Current-Max |
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
|
2.5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
|
6 ms
|
|
|
|
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