ATECC608A-TNGLORAU-G vs ATECC608B-TNGLORAU-B feature comparison

ATECC608A-TNGLORAU-G Microchip Technology Inc

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ATECC608B-TNGLORAU-B Microchip Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description UDFN-8 UDFN-8
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 3 mm 3 mm
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max 0.6 mm 0.6 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 2 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT CRYPTOGRAPHIC AUTHENTICATOR
Base Number Matches 1 1
Rohs Code Yes
Clock Frequency-Max 1 MHz
External Data Bus Width
Package Equivalence Code SOLCC8,.12,20

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