ATECC608A-TNGTLSU-C
vs
ATECC608B-TNGTLSU-B
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
UDFN-8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Bus Compatibility |
I2C
|
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.12,20
|
SOLCC8,.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.6 mm
|
0.6 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
2 mm
|
2 mm
|
| uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
CRYPTOGRAPHIC AUTHENTICATOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Clock Frequency-Max |
|
1 MHz
|
| External Data Bus Width |
|
|
|
|
|
Compare ATECC608A-TNGTLSU-C with alternatives
Compare ATECC608B-TNGTLSU-B with alternatives