ATSAM4S16CA-CU
vs
ATSAM4S16CA-CUR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
| Package Description |
TFBGA-100
|
TFBGA, BGA100,10X10,32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| CPU Family |
CORTEX-M4
|
CORTEX-M4
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| Length |
9 mm
|
9 mm
|
| Number of I/O Lines |
79
|
79
|
| Number of Terminals |
100
|
100
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA100,10X10,32
|
BGA100,10X10,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
131072
|
131072
|
| ROM (words) |
1048576
|
1048576
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Speed |
120 MHz
|
120 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.32 V
|
| Supply Voltage-Min |
1.08 V
|
1.08 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Supply Current-Max |
|
25 mA
|
|
|
|