ATSAM4SD32CA-AU
vs
ATSAM4SD32CB-CUR
feature comparison
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
|
TFBGA-100
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.31.00.01
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
24
|
| Bit Size |
|
32
|
| Clock Frequency-Max |
|
20 MHz
|
| DAC Channels |
|
YES
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
8
|
| JESD-30 Code |
|
S-PBGA-B100
|
| Length |
|
9 mm
|
| Number of I/O Lines |
|
79
|
| Number of Terminals |
|
100
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.1 mm
|
| Speed |
|
120 MHz
|
| Supply Voltage-Max |
|
1.32 V
|
| Supply Voltage-Min |
|
1.08 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
|
1
|
|
|
|
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