ATSAM4SD32CA-AUR
vs
ATSAM4SD32CB-CU
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ATMEL CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
LFQFP, QFP100,.63SQ,20
|
TFBGA-100
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
CPU Family |
CORTEX-M4
|
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G100
|
S-PBGA-B100
|
Length |
14 mm
|
9 mm
|
Number of I/O Lines |
79
|
79
|
Number of Terminals |
100
|
100
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
TFBGA
|
Package Equivalence Code |
QFP100,.63SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
|
RAM (bytes) |
163840
|
|
ROM (words) |
2097152
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.1 mm
|
Speed |
120 MHz
|
120 MHz
|
Supply Current-Max |
25 mA
|
|
Supply Voltage-Max |
1.32 V
|
1.32 V
|
Supply Voltage-Min |
1.08 V
|
1.08 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
14 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
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