ATWINC3400-MR210CA131
vs
ATWINC3400-MR210CA122-T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MODULE-36
|
MODULE-36
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
5A992.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
17 Weeks, 3 Days
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Additional Feature |
SEATED HGT-CALCULATED
|
SEATED HGT-CALCULATED
|
| JESD-30 Code |
R-XXMA-N36
|
R-XXMA-N36
|
| Length |
22.3774 mm
|
22.428 mm
|
| Number of Terminals |
36
|
36
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Seated Height-Max |
2.0874 mm
|
2.087 mm
|
| Supply Voltage-Max |
4.2 V
|
4.2 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.204 mm
|
1.204 mm
|
| Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
14.732 mm
|
14.732 mm
|
| uPs/uCs/Peripheral ICs Type |
Bluetooth SoC
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare ATWINC3400-MR210CA131 with alternatives
Compare ATWINC3400-MR210CA122-T with alternatives