AU5517D vs LM13700MX feature comparison

AU5517D NXP Semiconductors

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LM13700MX National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 PLASTIC, SOP-16
Pin Count 16 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture TRANSCONDUCTANCE TRANSCONDUCTANCE
Average Bias Current-Max (IIB) 8 µA 8 µA
Bias Current-Max (IIB) @25C 5 µA 8 µA
Common-mode Reject Ratio-Nom 110 dB 110 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 5000 µV 4000 µV
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Low-Offset NO NO
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -22 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Slew Rate-Nom 50 V/us 50 V/us
Supply Current-Max 4 mA
Supply Voltage Limit-Max 22 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
Common-mode Reject Ratio-Min 80 dB
JESD-609 Code e0
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 235
Terminal Finish Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) 30
Unity Gain BW-Nom 2000

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