AU5517D
vs
NE5517DG
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
SOIC
|
SOIC 16 LEAD
|
| Package Description |
SOP, SOP16,.25
|
SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
TRANSCONDUCTANCE
|
TRANSCONDUCTANCE
|
| Average Bias Current-Max (IIB) |
8 µA
|
8 µA
|
| Bias Current-Max (IIB) @25C |
5 µA
|
5 µA
|
| Common-mode Reject Ratio-Nom |
110 dB
|
110 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
5000 µV
|
5000 µV
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
9.9 mm
|
9.9 mm
|
| Low-Offset |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Slew Rate-Nom |
50 V/us
|
50 V/us
|
| Supply Current-Max |
4 mA
|
4 mA
|
| Supply Voltage Limit-Max |
22 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
751B-05
|
| Factory Lead Time |
|
2 Days
|
| Samacsys Manufacturer |
|
onsemi
|
| JESD-609 Code |
|
e3
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN
|
| Unity Gain BW-Nom |
|
2000
|
|
|
|
Compare AU5517D with alternatives
Compare NE5517DG with alternatives