AX1000-2FGG484 vs AX1000-FGG484 feature comparison

AX1000-2FGG484 Microsemi Corporation

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AX1000-FGG484 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA484,22X22,40 1 MM PITCH, ROHS COMPLIANT, FBGA-484
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1000000 SYSTEM GATES AVAILABLE 1000000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 870 MHz 649 MHz
Combinatorial Delay of a CLB-Max 0.74 ns 0.99 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 12096 12096
Number of Equivalent Gates 1000000 1000000
Number of Inputs 516 516
Number of Logic Cells 18144 18144
Number of Outputs 516 516
Number of Terminals 484 484
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 12096 CLBS, 1000000 GATES 12096 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 3 3
Factory Lead Time 12 Weeks
Packing Method TRAY

Compare AX1000-2FGG484 with alternatives

Compare AX1000-FGG484 with alternatives