AX500-2FG484I vs AX500-1FG484 feature comparison

AX500-2FG484I Microsemi Corporation

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AX500-1FG484 Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA484,22X22,40 1 MM PITCH, FBGA-484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 500000 SYSTEM GATES AVAILABLE 500000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 870 MHz 763 MHz
Combinatorial Delay of a CLB-Max 0.74 ns 0.84 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5376 5376
Number of Equivalent Gates 500000 500000
Number of Inputs 336 336
Number of Logic Cells 8064 8064
Number of Outputs 336 336
Number of Terminals 484 484
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 5376 CLBS, 500000 GATES 5376 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 3 3
Factory Lead Time 8 Weeks
Packing Method TRAY

Compare AX500-2FG484I with alternatives

Compare AX500-1FG484 with alternatives