AX500-2FGG676 vs AX500-FG676IX79 feature comparison

AX500-2FGG676 Microsemi Corporation

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AX500-FG676IX79 Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, BGA676,26X26,40 1 MM PITCH, FBGA-676
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 500000 SYSTEM GATES AVAILABLE 500000 SYSTEM GATES AVAILABLE
Clock Frequency-Max 870 MHz 649 MHz
Combinatorial Delay of a CLB-Max 0.74 ns 0.99 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5376 5376
Number of Equivalent Gates 500000 286000
Number of Inputs 336
Number of Logic Cells 8064
Number of Outputs 336
Number of Terminals 676 676
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 5376 CLBS, 500000 GATES 5376 CLBS, 286000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 3 1

Compare AX500-2FGG676 with alternatives

Compare AX500-FG676IX79 with alternatives