AX500-FG484M
vs
AX500-3FGG484I
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
1 MM PITCH, FBGA-484
|
BGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
500000 SYSTEM GATES AVAILABLE
|
500000 SYSTEM GATES AVAILABLE
|
Clock Frequency-Max |
649 MHz
|
|
Combinatorial Delay of a CLB-Max |
0.99 ns
|
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e0
|
e1
|
Length |
27 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
5376
|
|
Number of Equivalent Gates |
500000
|
286000
|
Number of Inputs |
336
|
|
Number of Logic Cells |
8064
|
|
Number of Outputs |
336
|
|
Number of Terminals |
484
|
484
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
5376 CLBS, 500000 GATES
|
286000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Seated Height-Max |
2.44 mm
|
2.44 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
23 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare AX500-FG484M with alternatives
Compare AX500-3FGG484I with alternatives