BB814
vs
BB201,215
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
End Of Life
|
Ihs Manufacturer |
TELEFUNKEN MICROELECTRONICS GMBH
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
compliant
|
Diode Capacitance-Nom |
44 pF
|
95 pF
|
Diode Type |
VARIABLE CAPACITANCE DIODE
|
VARIABLE CAPACITANCE DIODE
|
JESD-609 Code |
e0
|
e3
|
Rep Pk Reverse Voltage-Max |
18 V
|
15 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin (Sn)
|
Base Number Matches |
7
|
1
|
Part Package Code |
|
TO-236
|
Package Description |
|
PLASTIC PACKAGE-3
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT23
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Configuration |
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Cap Tolerance |
|
6.81%
|
Diode Capacitance Ratio-Min |
|
3.1
|
Diode Element Material |
|
SILICON
|
JEDEC-95 Code |
|
TO-236AB
|
JESD-30 Code |
|
R-PDSO-G3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
2
|
Number of Terminals |
|
3
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Variable Capacitance Diode Classification |
|
ABRUPT
|
|
|
|
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