BC817-25E6327 vs BC817-25,235 feature comparison

BC817-25E6327 Infineon Technologies AG

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BC817-25,235 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC PACKAGE-3
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.5 A 0.5 A
Collector-Emitter Voltage-Max 45 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 100 160
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.33 W 0.25 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 170 MHz 100 MHz
Base Number Matches 3 2
Part Package Code TO-236
Pin Count 3
Manufacturer Package Code SOT23
Factory Lead Time 4 Weeks
Collector-Base Capacitance-Max 3 pF
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Operating Temperature-Min -65 °C
Reference Standard IEC-60134
Terminal Finish Tin (Sn)
Transistor Application SWITCHING
VCEsat-Max 0.7 V

Compare BC817-25E6327 with alternatives

Compare BC817-25,235 with alternatives