BC847AM,315 vs BC849C feature comparison

BC847AM,315 NXP Semiconductors

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BC849C Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DFN
Package Description 1 X 0.60 MM, 0.50 MM HEIGHT, ULTRA SMALL, LEADLESS, PLASTIC, SC-101, 3 PIN SMALL OUTLINE, R-PDSO-G3
Pin Count 3
Manufacturer Package Code SOT883
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
Factory Lead Time 4 Weeks
Case Connection COLLECTOR
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 45 V 30 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 110 110
JESD-30 Code R-PBCC-N3 R-PDSO-G3
JESD-609 Code e3 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.25 W 0.3 W
Qualification Status Not Qualified Not Qualified
Reference Standard IEC-60134
Surface Mount YES YES
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form NO LEAD GULL WING
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 300 MHz
Base Number Matches 2 27
Additional Feature LOW NOISE
JEDEC-95 Code TO-236AB

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