BC850BMTF
vs
933589700235
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
Package Description |
LEAD FREE PACKAGE-3
|
PLASTIC PACKAGE-3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
LOW NOISE
|
LOW NOISE
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
45 V
|
45 V
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
200
|
420
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity/Channel Type |
NPN
|
NPN
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
300 MHz
|
100 MHz
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
JEDEC-95 Code |
|
TO-236AB
|
|
|
|
Compare BC850BMTF with alternatives
Compare 933589700235 with alternatives