BC858ATC vs BC858B,215 feature comparison

BC858ATC Diodes Incorporated

Buy Now Datasheet

BC858B,215 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G3 PLASTIC, SST3, SMD, 3 PIN
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 125 220
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 150 MHz 100 MHz
Base Number Matches 2 2
Rohs Code Yes
Part Package Code TO-236
Pin Count 3
Manufacturer Package Code SOT23
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
JEDEC-95 Code TO-236AB
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 0.3 W
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
VCEsat-Max 0.65 V

Compare BC858ATC with alternatives

Compare BC858B,215 with alternatives