BC858C vs BC858CW feature comparison

BC858C Micro Commercial Components

Buy Now Datasheet

BC858CW NXP Semiconductors

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS CORP NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-3
Pin Count 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Samacsys Manufacturer MCC
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 420 420
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Power Dissipation-Max (Abs) 0.31 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 200 MHz 100 MHz
Base Number Matches 16 4
Collector-Base Capacitance-Max 5 pF
Polarity/Channel Type PNP
VCEsat-Max 0.65 V

Compare BC858C with alternatives

Compare BC858CW with alternatives