BCM53101MIMLG
vs
KSZ8567RTXV-VAO
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
BROADCOM LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
, SLGA132,18X18,20
|
TQFP-128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
50 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
132
|
128
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SLGA132,18X18,20
|
TQFP128,.63SQ,16
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
203.6 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET SWITCH
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Base Number Matches |
2
|
1
|
| Date Of Intro |
|
2017-05-04
|
| JESD-30 Code |
|
S-PQFP-G128
|
| Length |
|
14 mm
|
| Number of Functions |
|
1
|
| Package Code |
|
HTFQFP
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Nom |
|
1.2 V
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.4 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
14 mm
|
|
|
|
Compare BCM53101MIMLG with alternatives
Compare KSZ8567RTXV-VAO with alternatives