BCM53158XUB1KFBG
vs
VSC8258YMR-01
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
BROADCOM INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LFBGA,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
50 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| JESD-30 Code |
S-PBGA-B311
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| Length |
13 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
311
|
256
|
| Operating Temperature-Max |
70 °C
|
110 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
| Seated Height-Max |
1.337 mm
|
2.7 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
17 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
5A002.A.1
|
| Data Rate |
|
10000000 Mbps
|
| Number of Transceivers |
|
4
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
|
|
|
Compare BCM53158XUB1KFBG with alternatives
Compare VSC8258YMR-01 with alternatives