BCM53158XUB1KFBG
vs
VSC8522XJQ-02
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
BROADCOM INC
|
MICROSEMI CORP
|
| Package Description |
LFBGA,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
50 Weeks
|
|
| Samacsys Manufacturer |
Avago Technologies
|
Microsemi Corporation
|
| JESD-30 Code |
S-PBGA-B311
|
|
| JESD-609 Code |
e1
|
|
| Length |
13 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
311
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Seated Height-Max |
1.337 mm
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Width |
13 mm
|
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
5A991.C
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BCM53158XUB1KFBG with alternatives
Compare VSC8522XJQ-02 with alternatives