BCP56T vs BCP56T/R feature comparison

BCP56T NXP Semiconductors

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BCP56T/R NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC, SC-73, 4 PIN PLASTIC, SC-73, 4 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Configuration SINGLE SINGLE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation Ambient-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Collector Current-Max (IC) 1 A
Collector-Emitter Voltage-Max 80 V
DC Current Gain-Min (hFE) 40
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN
Power Dissipation-Max (Abs) 1.5 W
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40
Transition Frequency-Nom (fT) 130 MHz

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