BCV27 vs BCV27 feature comparison

BCV27 NXP Semiconductors

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BCV27 STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code SOT-23
Package Description PLASTIC PACKAGE-3
Pin Count 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Samacsys Manufacturer NXP
Collector Current-Max (IC) 0.5 A
Collector-Emitter Voltage-Max 30 V
Configuration DARLINGTON
DC Current Gain-Min (hFE) 20000
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN
Power Dissipation-Max (Abs) 0.25 W
Qualification Status Not Qualified
Surface Mount YES
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application AMPLIFIER
Transistor Element Material SILICON
Transition Frequency-Nom (fT) 220 MHz
VCEsat-Max 1 V
Base Number Matches 9 1

Compare BCV27 with alternatives

Compare BCV27 with alternatives