BCV62C,235 vs BCV62,235 feature comparison

BCV62C,235 NXP Semiconductors

Buy Now Datasheet

BCV62,235 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC PACKAGE-4
Pin Count 4 4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration CURRENT MIRROR CURRENT MIRROR
DC Current Gain-Min (hFE) 420 100
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOT-143
Manufacturer Package Code SOT143B
HTS Code 8541.21.00.95
Factory Lead Time 4 Weeks
Case Connection COLLECTOR
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
VCEsat-Max 0.65 V

Compare BCV62C,235 with alternatives

Compare BCV62,235 with alternatives