BD6211F-E2
vs
BD6211HFP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
MODULE
|
| Package Description |
SOP-8
|
, SMSIP7H,.4,50TB
|
| Pin Count |
8
|
7
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
14 Weeks
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Analog IC - Other Type |
BRUSH DC MOTOR CONTROLLER
|
BRUSH DC MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PSSO-G7
|
| JESD-609 Code |
e3
|
e2
|
| Length |
5 mm
|
9.395 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
7
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP8,.25
|
SMSIP7H,.4,50TB
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max (Isup) |
1.7 mA
|
1.5 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
8 mm
|
| Base Number Matches |
1
|
2
|
| Seated Height-Max |
|
2.005 mm
|
|
|
|
Compare BD6211F-E2 with alternatives
Compare BD6211HFP with alternatives