BD63874EFV-E2
vs
BD6387EFV-E2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SSOP
|
TSSOP
|
| Package Description |
HVSSOP, TSSOP28,.25
|
HVSSOP,
|
| Pin Count |
28
|
40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
ROHM Semiconductor
|
| Analog IC - Other Type |
STEPPER MOTOR CONTROLLER
|
STEPPER MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G40
|
| Length |
9.7 mm
|
13.6 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
40
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Output Current-Max |
2 A
|
2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSSOP
|
HVSSOP
|
| Package Equivalence Code |
TSSOP28,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max (Isup) |
5 mA
|
|
| Supply Voltage-Max (Vsup) |
28 V
|
28 V
|
| Supply Voltage-Min (Vsup) |
19 V
|
10 V
|
| Supply Voltage-Nom (Vsup) |
24 V
|
24 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
5.4 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BD63874EFV-E2 with alternatives
Compare BD6387EFV-E2 with alternatives