BF1100,215
vs
3SK295
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOT-143
|
|
| Package Description |
MICRO MINIATURE, PLASTIC PACKAGE-4
|
MPAK-4
|
| Pin Count |
4
|
4
|
| Manufacturer Package Code |
SOT143B
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.21.00.75
|
|
| Additional Feature |
LOW NOISE
|
|
| Case Connection |
SOURCE
|
SOURCE
|
| Configuration |
COMPLEX
|
SINGLE
|
| DS Breakdown Voltage-Min |
14 V
|
12 V
|
| Drain Current-Max (ID) |
0.03 A
|
0.025 A
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
0.035 pF
|
0.03 pF
|
| Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
| JESD-609 Code |
e3
|
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Mode |
DUAL GATE, ENHANCEMENT MODE
|
DUAL GATE, DEPLETION MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
7
|
| Date Of Intro |
|
1997-03-01
|
| Power Dissipation-Max (Abs) |
|
0.15 W
|
| Power Gain-Min (Gp) |
|
16 dB
|
|
|
|
Compare BF1100,215 with alternatives
Compare 3SK295 with alternatives