BF1100,215
vs
BF1100T/R
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-143
|
|
Package Description |
MICRO MINIATURE, PLASTIC PACKAGE-4
|
MICRO MINIATURE, PLASTIC PACKAGE-4
|
Pin Count |
4
|
4
|
Manufacturer Package Code |
SOT143B
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.75
|
|
Additional Feature |
LOW NOISE
|
LOW NOISE
|
Case Connection |
SOURCE
|
SOURCE
|
Configuration |
COMPLEX
|
COMPLEX
|
DS Breakdown Voltage-Min |
14 V
|
14 V
|
Drain Current-Max (ID) |
0.03 A
|
0.03 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
0.035 pF
|
0.035 pF
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
JESD-609 Code |
e3
|
e3
|
Number of Elements |
2
|
2
|
Number of Terminals |
4
|
4
|
Operating Mode |
DUAL GATE, ENHANCEMENT MODE
|
DUAL GATE, ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare BF1100,215 with alternatives
Compare BF1100T/R with alternatives