BF570
vs
BFG65
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOT-23
|
|
| Package Description |
PLASTIC PACKAGE-3
|
DISK BUTTON, O-PRDB-F4
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
0.1 A
|
0.05 A
|
| Collector-Base Capacitance-Max |
2.2 pF
|
|
| Collector-Emitter Voltage-Max |
15 V
|
10 V
|
| Configuration |
SINGLE
|
SINGLE
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
O-PRDB-F4
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
4
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
DISK BUTTON
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Position |
DUAL
|
RADIAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
500 MHz
|
8000 MHz
|
| Base Number Matches |
5
|
1
|
| Additional Feature |
|
LOW NOISE
|
| DC Current Gain-Min (hFE) |
|
60
|
| Highest Frequency Band |
|
L BAND
|
| Reference Standard |
|
CECC
|
|
|
|
Compare BF570 with alternatives
Compare BFG65 with alternatives