BFR30
vs
BFR30T/R
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| FET Technology |
JUNCTION
|
JUNCTION
|
| Feedback Cap-Max (Crss) |
1.5 pF
|
1.5 pF
|
| JEDEC-95 Code |
TO-226AA
|
TO-236AB
|
| JESD-30 Code |
O-PBCY-T3
|
R-PDSO-G3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
18
|
3
|
| Part Package Code |
|
SOT-23
|
| Package Description |
|
PLASTIC PACKAGE-3
|
| Pin Count |
|
3
|
| DS Breakdown Voltage-Min |
|
25 V
|
| Drain Current-Max (ID) |
|
0.01 A
|
| Operating Temperature-Max |
|
150 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max (Abs) |
|
0.3 W
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Transistor Application |
|
AMPLIFIER
|
|
|
|
Compare BFR30 with alternatives
Compare BFR30T/R with alternatives