BLV897
vs
TP3032
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
SOT
|
|
| Package Description |
FLANGE MOUNT, R-CDFM-F4
|
FLANGE MOUNT, R-CDFM-F6
|
| Pin Count |
5
|
|
| Manufacturer Package Code |
SOT324B
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS
|
|
| Case Connection |
EMITTER
|
|
| Collector Current-Max (IC) |
5 A
|
4 A
|
| Collector-Emitter Voltage-Max |
30 V
|
|
| Configuration |
COMMON EMITTER, 2 ELEMENTS
|
SINGLE
|
| Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
| JESD-30 Code |
R-CDFM-F4
|
R-CDFM-F6
|
| Number of Elements |
2
|
1
|
| Number of Terminals |
4
|
6
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
3
|
| HTS Code |
|
8541.29.00.75
|
| DC Current Gain-Min (hFE) |
|
15
|
| Operating Temperature-Max |
|
200 °C
|
| Power Dissipation Ambient-Max |
|
52.5 W
|
| Power Dissipation-Max (Abs) |
|
52 W
|
| Power Gain-Min (Gp) |
|
7.5 dB
|
|
|
|
Compare BLV897 with alternatives
Compare TP3032 with alternatives