BLV945B
vs
2N6082
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
MICROSEMI CORP
|
| Package Description |
,
|
POST/STUD MOUNT, O-XRPM-F4
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
2 A
|
4 A
|
| Configuration |
SINGLE
|
SINGLE WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
30
|
5
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
60 W
|
50 W
|
| Surface Mount |
NO
|
NO
|
| Base Number Matches |
3
|
9
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Pin Count |
|
4
|
| Additional Feature |
|
HIGH EFFICIENCY, WITH EMITTER BALLASTED RESISTORS
|
| Collector-Base Capacitance-Max |
|
130 pF
|
| Collector-Emitter Voltage-Max |
|
18 V
|
| Highest Frequency Band |
|
VERY HIGH FREQUENCY BAND
|
| JESD-30 Code |
|
O-XRPM-F4
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
4
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Shape |
|
ROUND
|
| Package Style |
|
POST/STUD MOUNT
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
FLAT
|
| Terminal Position |
|
RADIAL
|
| Transistor Application |
|
AMPLIFIER
|
| Transistor Element Material |
|
SILICON
|
| Transition Frequency-Nom (fT) |
|
200 MHz
|
|
|
|
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