BPA08SB
vs
NDS-12T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
C & K COMPONENTS LLC
|
APEM COMPONENTS INC
|
| Package Description |
ROHS COMPLIANT
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.50.90.65
|
8536.50.90.65
|
| Actuator Length |
0.083 inch
|
0.039 inch
|
| Actuator Material |
POLYAMIDE
|
GLASS FILLED POLYBUTYLENE TEREPHTHALATE
|
| Actuator Type |
SLIDE
|
SLIDE
|
| Additional Feature |
ROHS COMPLIANT
|
RAISED ACTUATOR
|
| Body Breadth |
8.15 mm
|
10.16 mm
|
| Body Height |
6 mm
|
5.9944 mm
|
| Body Length or Diameter |
22.3 mm
|
32.1564 mm
|
| Center Contact Material |
BERYLLIUM COPPER
|
PHOSPHOR BRONZE
|
| Center Contact Plating |
GOLD OVER NICKEL
|
GOLD OVER NICKEL
|
| Contact Current(DC)-Max |
0.1 A
|
0.025 A
|
| Contact (DC) Max Rating R Load |
.1A@5VDC
|
0.025A@24VDC
|
| Contact Resistance |
0.05 mΩ
|
0.05 mΩ
|
| Contact Voltage(DC)-Max |
5 V
|
24 V
|
| Dielectric Withstand Volts |
300VAC V
|
500VDC V
|
| Electrical Life |
1000 Cycle(s)
|
2000 Cycle(s)
|
| End Contact Material |
BERYLLIUM COPPER
|
PHOSPHOR BRONZE
|
| End Contact Plating |
GOLD OVER NICKEL
|
GOLD OVER NICKEL
|
| Housing Material |
POLYPHENYLENE SULPHIDE
|
GLASS FILLED POLYBUTYLENE TEREPHTHALATE
|
| Insulation Resistance |
100000000 Ω
|
100000000 Ω
|
| JESD-609 Code |
e4
|
|
| Mounting Feature |
SURFACE MOUNT-STRAIGHT
|
THROUGH HOLE-STRAIGHT
|
| Number of Positions |
8
|
12
|
| Number of Switch Sections |
1
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Packing Method |
TUBE
|
|
| Surface Mount |
NO
|
NO
|
| Switch Action |
LATCHED
|
MAINTAINED
|
| Switch Function |
SPST
|
SPST
|
| Switch Type |
SLIDE DIP SWITCH
|
SLIDE DIP SWITCH
|
| Terminal Finish |
GOLD OVER NICKEL
|
|
| Terminal Material |
BRASS
|
PHOSPHOR BRONZE
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
2
|
1
|
| Body Color |
|
BLACK
|
| Contact Function |
|
ON-OFF
|
| Insulator Material |
|
GLASS FILLED POLYBUTYLENE TEREPHTHALATE
|
| PCB Hole Count |
|
24
|
| Sealing |
|
EPOXY
|
| Solderability |
|
WAVE
|
| Terminal Length |
|
0.118 inch
|
| Washability |
|
SOLVENT
|
|
|
|
Compare BPA08SB with alternatives
Compare NDS-12T with alternatives