BQ51011YFFT
vs
BQ51010YFFR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
DSBGA-28
|
VFBGA,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
JESD-30 Code |
R-XBGA-B28
|
R-XBGA-B28
|
JESD-609 Code |
e1
|
|
Length |
2.76 mm
|
2.76 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.625 mm
|
0.625 mm
|
Supply Voltage-Nom |
5 V
|
7 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.56 mm
|
1.56 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BQ51011YFFT with alternatives
Compare BQ51010YFFR with alternatives