BSC040N08NS5ATMA1
vs
BSB044N08NN3G
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
INFINEON TECHNOLOGIES AG
|
Package Description |
SMALL OUTLINE, R-PDSO-F5
|
CHIP CARRIER, R-MBCC-N3
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
20 Weeks
|
|
Samacsys Manufacturer |
Infineon
|
|
Avalanche Energy Rating (Eas) |
120 mJ
|
660 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
80 V
|
80 V
|
Drain Current-Max (ID) |
19 A
|
18 A
|
Drain-source On Resistance-Max |
0.004 Ω
|
0.0044 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PDSO-F8
|
R-MBCC-N3
|
JESD-609 Code |
e3
|
e4
|
Moisture Sensitivity Level |
1
|
3
|
Number of Elements |
1
|
1
|
Number of Terminals |
8
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
METAL
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
400 A
|
360 A
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin (Sn)
|
Silver/Nickel (Ag/Ni)
|
Terminal Form |
FLAT
|
NO LEAD
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Pin Count |
|
3
|
Operating Temperature-Max |
|
150 °C
|
Power Dissipation-Max (Abs) |
|
78 W
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare BSC040N08NS5ATMA1 with alternatives
Compare BSB044N08NN3G with alternatives