BSP50,115 vs BSP50E6327XT feature comparison

BSP50,115 NXP Semiconductors

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BSP50E6327XT Siemens

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Source Content uid BSP50,115
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SIEMENS A G
Part Package Code SC-73 SOT-223
Package Description PLASTIC, SMD, SC-73, 4 PIN SMALL OUTLINE, R-PDSO-G4
Pin Count 4 4
Manufacturer Package Code SOT223
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.5 A 1 A
Collector-Emitter Voltage-Max 45 V 45 V
Configuration DARLINGTON WITH BUILT-IN DIODE AND RESISTOR DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 2000 2000
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 2
Number of Terminals 4 4
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 1.5 W
Power Dissipation-Max (Abs) 1.5 W
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 200 MHz 200 MHz
VCEsat-Max 1.3 V
Base Number Matches 2 1
Turn-off Time-Max (toff) 1500 ns
Turn-on Time-Max (ton) 400 ns

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