BSP50E6327 vs BSP51 feature comparison

BSP50E6327 Infineon Technologies AG

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BSP51 Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG FAIRCHILD SEMICONDUCTOR CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 1 A 0.5 A
Collector-Emitter Voltage-Max 45 V 80 V
Configuration DARLINGTON SINGLE
DC Current Gain-Min (hFE) 2000 2000
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 200 MHz
Turn-off Time-Max (toff) 1500 ns
Turn-on Time-Max (ton) 400 ns
Base Number Matches 2 9
Part Package Code SOT-223
Package Description LEAD FREE PACKAGE-4
Pin Count 4
Manufacturer Package Code MOLDED PACKAGE, SOT-223, 4 LEAD
HTS Code 8541.21.00.95
Time@Peak Reflow Temperature-Max (s) 30

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