BSP51,115 vs BSP52E6327HTSA1 feature comparison

BSP51,115 NXP Semiconductors

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BSP52E6327HTSA1 Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Part Package Code SC-73
Package Description PLASTIC, SMD, SC-73, 4 PIN GREEN, PLASTIC PACKAGE-4
Pin Count 4 4
Manufacturer Package Code SOT223
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.5 A 1 A
Collector-Emitter Voltage-Max 60 V 80 V
Configuration DARLINGTON WITH BUILT-IN DIODE AND RESISTOR DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 2000 2000
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 1.5 W
Power Dissipation-Max (Abs) 1.5 W
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Finish TIN Matte Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 200 MHz 200 MHz
VCEsat-Max 1.3 V
Base Number Matches 2 1
Pbfree Code Yes
Reference Standard AEC-Q101

Compare BSP51,115 with alternatives

Compare BSP52E6327HTSA1 with alternatives