BSP52T3G vs BSP50,115 feature comparison

BSP52T3G onsemi

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BSP50,115 NXP Semiconductors

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Source Content uid BSP52T3G BSP50,115
Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code TO-261AA SC-73
Package Description SMALL OUTLINE, R-PDSO-G4 PLASTIC, SMD, SC-73, 4 PIN
Pin Count 4 4
Manufacturer Package Code 0.0318 SOT223
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
Factory Lead Time 64 Weeks
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 1 A 0.5 A
Collector-Emitter Voltage-Max 80 V 45 V
Configuration DARLINGTON DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 2000 2000
JEDEC-95 Code TO-261AA
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 1.25 W 1.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish MATTE TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Rohs Code Yes
HTS Code 8541.29.00.75
Power Dissipation Ambient-Max 1.5 W
Transition Frequency-Nom (fT) 200 MHz
VCEsat-Max 1.3 V

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