BSP742T
vs
BSP742T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
SIEMENS A G
|
| Part Package Code |
SOIC
|
|
| Package Description |
SO-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Infineon
|
|
| Built-in Protections |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
|
OVER CURRENT; OVER VOLTAGE; THERMAL
|
| Driver Number of Bits |
1
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Output Current Flow Direction |
SINK
|
SOURCE
|
| Output Current-Max |
0.8 A
|
|
| Output Peak Current Limit-Nom |
1.1 A
|
1.1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.73 mm
|
|
| Supply Voltage-Max |
34 V
|
34 V
|
| Supply Voltage-Min |
5 V
|
5 V
|
| Supply Voltage-Nom |
13.5 V
|
13.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
MOS
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Turn-off Time |
170 µs
|
170 µs
|
| Turn-on Time |
140 µs
|
140 µs
|
| Width |
4 mm
|
|
| Base Number Matches |
5
|
1
|
|
|
|